The Thermalright LGA1700 Anti-Bending Buckle is a precision-engineered CPU contact frame designed to prevent bending issues commonly seen in Intel 12th and 13th generation processors using the LGA1700 socket. By replacing the stock motherboard retention mechanism, this bracket distributes pressure evenly across the CPU surface, ensuring better contact between the processor and the cooler.

Manufactured from high-quality CNC-machined aluminum alloy with an anodized sandblasted finish, the frame is durable, lightweight, and designed to avoid interference with nearby motherboard capacitors. The integrated insulation foot pads follow the same specification used in LOTES socket designs, protecting the CPU surface while maintaining balanced pressure.

The kit includes TF7 thermal paste (2g) and an L-shaped installation screwdriver, allowing quick and easy installation. Once installed, the frame helps improve thermal transfer efficiency and supports the weight of heavy air coolers or liquid cooling systems while reducing the risk of CPU bending.

Key Features

• Designed to prevent CPU bending on Intel LGA1700 platforms

• CNC-machined anodized aluminum construction

• Even pressure distribution for improved cooler contact

• LOTES-spec insulation protection pads

• Includes TF7 thermal paste (2g) and L-shaped screwdriver

• Compact and lightweight design for easy installation

Specifications

• Dimensions: 54 × 70 × 6 mm

• Material: Aluminum Alloy

• Main Body Weight: 20 g

• Total Package Weight: 55 g

• Color: Black

Compatibility

• Intel 12th Gen Processors

• Intel 13th Gen Processors

• LGA1700 Motherboards including:

  • H610

  • B660 / B760

  • Z690 / Z790