Red aluminum contact frame for Intel LGA1700 sockets that replaces the stock ILM to improve mounting pressure distribution and CPU cooler contact.

The Thermalright LGA1700‑BCF Red anti‑bend contact frame is engineered to replace the stock Intel ILM (Independent Loading Mechanism) on LGA1700 motherboards — supporting Intel 12th, 13th, and 14th generation CPUs. Made from durable red anodized aluminum alloy, it measures 54 × 70 × 6 mm and weighs approximately 20 g, providing a sturdy and lightweight solution to distribute mounting pressure evenly across the CPU’s integrated heat spreader. This helps maintain consistent contact between the CPU and cooler, improving thermal performance and reducing potential stress on the motherboard. The package includes an L‑shaped screwdriver and a TF7 thermal paste small tube, and the frame comes with a 6‑year warranty.