High‑conductivity solid thermal interface sheet with 8.5 W/mK for efficient heat transfer between CPU/GPU and heatsinks, non‑conductive and easy to install.

The Thermalright Heilos Solid Thermal Interface Sheet is a premium solid thermal pad designed for reliable heat transfer between CPUs, GPUs, and heatsinks. With a thermal conductivity of 8.5 W/mK, it efficiently dissipates heat, improving overall cooling performance for desktops, laptops, and other systems. Made from high-quality silicone, it contains no metal particles, making it completely non-conductive and safe for all electronic components. The sheet is easy to install and provides long-term durability, ensuring consistent thermal performance over extended use. Ideal for AMD and general-purpose applications, the Heilos thermal interface sheet offers a clean, mess-free alternative to traditional thermal paste.